8.DURABILITY 耐久性

8.1

SLLDERING

TEST

可焊性試驗

The tip of the terminals shall be

dipped 2mm in the solder bath at a

Temperature of 230±5℃ for 3±0.5sec.

端子頂部被浸入焊錫池2mm深,溫度230±5℃

時間3±0.5秒.

A new uniform coating of solder Shall cover a minimum of 75% of the surface being immersed.

浸入的部分75%以上表面將被錫覆蓋。

8.2

RESISTANCE

TO

SOLDERING

HEAT TEST

耐焊性試驗

Solder bath method

Solder temperature 230±5℃

Immersion time 3±0.5scc

Immersion depth up to the surface of

the board

Thickness of PCB 1.6 mm.

焊爐焊的溫度控制在230±5℃，過爐焊接的時間3±0.5秒，于(蒸板)厚度為1.6 mm.

Solder bath method

Bit temperature 300±10℃

application time 3±0.5scc

however excessive pressure shall not be applied to the terminal.

手焊接的時候溫度需控制在300±10℃，時間為

3±0.5秒，但不能在排腳上施加異常壓力。

Without deformation of case

Or excessive looseness of

mechanically electrical characteristics

Shall be satisfied.

本體無變形，能滿足于機械、電器性能。

8.3

LIFI TEST

壽命試驗

10000cycles of operation at a rate

of 15-18 cycles per minute with unloading.

無負載條件下,每分鐘15-18次的速度操作10000次.

(1)Contact resistance接觸阻抗.

100mΩ max.100毫歐以下.

(2)Operating force動作力. ±30%Inltial value.

變化范圍初始值±30%.

(3)ITEN 項目—6.2

(4)ITEN 項目—6.3

(5)ITEN 項目—7.2

(6)ITEN 項目—7.3

8.4

HEAT TEST

耐熱試驗

80±2℃ for 96 hours , caner test keep

in normal condition for 30minutes.

在80±2℃環(huán)境中放96小時,再放在正常環(huán)境中

30分鐘后進行測試.

(1)Contact resistance 150mΩ max.

接觸電阻150毫歐以下.

(2)Insulation resistance

絕緣電阻.

50MΩmin 50兆歐以上.

(3)There shall be no sign of damage mechanically and electrically.

無任何跡象顯示機械及電器性能之損壞.

8.5

HUMIDITY TEST

耐濕試驗

40±2℃ 90-95%RH for 96firs after test

keep in mortal condition for 30 min.

在40±2℃ 90-95%RH環(huán)境中放96小時,再放在正常環(huán)境中,30分鐘后進行測試.

8.6

COLD TEST

耐冷試驗

At -20±3℃ for 96hours,after test

kept in normal condition for 30 min.

在-20±3℃ 環(huán)境中放96小時,再置于正常環(huán)境中,30分鐘后進行測試.